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Glass Passivated Die Construction
•• Diffused Junction
•• Low Forward Voltage Drop, High Current Capability
•• Surge Overload Rating to 50A Peak
•• Designed for Printed Circuit Board Applications
•• Plastic Material - UL Flammability Classification 94V-0
•• UL Listed Under Recognized Component Index, File Number E94661
Mechanical Data___________________
•• Case: Molded Plastic
•• Terminals: Solder Plated Leads, Solderable per MIL-STD-202, Method 208
•• Polarity: As Marked on Case
•• Approx. Weight: 0.38 grams
•• Mounting Position: Any
•• Marking: Type Number
DF-M | ||
Dim | Min | Max |
A | 7.40 | 7.90 |
B | 6.20 | 6.50 |
C | 0.22 | 0.30 |
D | 1.27 | 2.03 |
E | 7.60 | 8.90 |
G | 3.81 | 4.69 |
H | 8.13 | 8.51 |
J | 2.40 | 2.60 |
K | 5.00 | 5.20 |
L | 0.46 | 0.58 |
All Dimensions in mm | ||
Maximum Ratings and Electrical Characteristics @ ta = 25°C unless otherwise specified
Single phase, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic | Symbol | DF 005M | DF 01M | DF 02M | DF 04M | DF 06M | DF 08M | DF 10M | Unit |
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage | Vrmm Vrwm Vr | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
RMS Reverse Voltage | Vrms | 35 | 70 | 140 | 280 | 420 | 580 | 700 | V |
Average Rectified Output Current @ TA = 40°C | Io | 1.0 | A | ||||||
Non-Repetitive Peak Forward Surge Current, 8.3 ms single half-sine-wave superimposed on rated load (JEDEC method) | Ifsm | 50 | A | ||||||
Forward Voltage (per element) @ IF = 1.0 A | Vfm | 1.1 | V | ||||||
Peak Reverse Current @ TA= 25°C at Rated DC Blocking Voltage (per element) @ TA= 125°C | Irm | 10 500 | MA | ||||||
I2t Rating for Fusing (t<8.3ms) | I2t | 10.4 | A2s | ||||||
Typical Junction Capacitance per element (Note 1) | Cj | 25 | pF | ||||||
Typical Thermal Resistance, Junction to Ambient (Note 2) | ReJA | 40 | °C/W | ||||||
Operating and Storage Temperature Range | Tj,Tstg | -65 to +150 | °C | ||||||
Notes: 1. Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.
2. Thermal Resistance, junction to ambient, measured on PC board with 5.02mm (0.03mm thick) land areas.